Demand for silicone thermal interface materials may explode

Global Silicone Network January 17th: With the advent of the era of the Internet of Everything, the integration of electronic products continues to improve, coupled with the introduction of high-frequency signals, the upgrade of hardware components, and the exponential increase in the number of networking equipment and antennas, resulting in The power consumption of the equipment continues to increase, and the heat generation also increases rapidly. The thermal interface material has excellent thermal conductivity and strong environmental adaptability, which provides a powerful help for the high integration and miniaturization of equipment, and is expected to become the most disruptive and transformative thermal management solution. From an industrial perspective, the electronics industry represented by the three hotspots has put forward more and more demands for advanced thermal management systems and thermal interface materials:

Smart consumer electronics: Smart phone and tablet electronic products are tightly structured and highly integrated, and the continuous improvement of heat flux density has put forward higher and higher requirements for thermal management systems.

Communication equipment: The complexity of communication equipment is getting higher and higher, the power consumption is increasing, and the calorific value is rising rapidly, which will bring huge incremental demand for thermal interface materials.

Automotive electronics: On the one hand, the working temperature of the engine electronic control module, ignition module, power module and various sensors is extremely high. On the other hand, the battery power of new energy vehicles is huge, and traditional air cooling and water cooling are not enough to cope with the huge heat dissipation. There is an urgent and personalized demand for thermal interface materials.

In addition, devices used in aviation, aerospace, military and other fields usually need to operate in harsh environments such as high frequency, high voltage, high power and extreme temperatures, and require high reliability, long trouble-free working time, and the need for heat dissipation materials. The overall performance requirements are also extremely high.